Thermal Interface Materials
Perfectly fills microscopic gaps. Full range of K-values and viscosities benchmarked against top brands.
Thermal Paste
Economic general-purpose thermal paste with good thermal conductivity and electrical insulation. Highly stable physical properties; will not dry out or bleed under high temperatures. Ideal for power modules and appliance control boards.
Thermal Paste
Standard industrial-grade thermal paste. Enhanced thermal wetting properties allow tighter adhesion to heatsinks and processor surfaces, significantly reducing contact thermal resistance. Suitable for LED drivers and inverters.
Thermal Paste
Enhanced thermal paste refined with special composite oxides. Further improved thermal conductivity with near-zero oil bleed. Maintains excellent cooling performance and insulation even under severe thermal cycling.
Thermal Paste
High-performance thermal paste developed for high heat density industrial chips. Features excellent low thermal resistance and extrusion flowability, making it highly suitable for automated dispensing on production lines.
Thermal Paste
Premium specialized thermal paste with outstanding thermal conductivity. Utilizes ultra-fine powder encapsulation technology to perfectly fill microscopic interface gaps, vastly reducing overall thermal resistance for high-end telecom equipment.
Thermal Paste
Flagship ultra-high thermal conductivity paste tailored for extreme cooling environments and high-power semiconductor chips. Special high-temp formulation ensures absolute prevention of dry-out and pump-out effects.
Various thicknesses, hardness levels, and tackiness options for versatile gap filling.
Thermal Pad (10S = Single-Sided Adhesive)
Basic thermal pad with good elasticity and compressibility. Effectively bridges physical gaps between heat-generating components and heatsinks, absorbing tolerances for stable heat transfer. Ideal for network products and set-top boxes.
Thermal Pad (15S = Single-Sided Adhesive)
Upgraded thermal pad featuring an extremely soft texture. Achieves perfect conformal fitting under very low pressure. Offers high dielectric breakdown voltage and shock absorption, widely used in automotive control boards.
Thermal Pad (20S = Single-Sided Adhesive)
High dielectric strength thermal pad balancing heat transfer and electrical insulation. Comprehensive thickness options adapt to uneven PCB surfaces. Suitable for SMPS, UPS, and motor controllers.
Thermal Pad (30S = Single-Sided Adhesive)
High-performance thermal pad providing an efficient heat channel. Features excellent tear resistance and low oil bleed rate. Sustains intimate interface contact under long-term extreme working temperatures.
Thermal Pad (40S = Single-Sided Adhesive)
Heavy-duty industrial thermal pad developed for high heat flux density units like servers and high-speed routers. The low thermal resistance formula ensures perfect fitting under high compression.
Thermal Pad (50S = Single-Sided Adhesive)
Ultra-high conductivity pad. Its softness and micro-tackiness completely eliminate interface air resistance. Applicable for 5G RF modules, high-speed SSDs, and advanced GPUs with strict thermal control demands.
Thermal Pad (60S = Single-Sided Adhesive)
Top-tier electronic grade thermal pad combining high-fill conductive particle technology with an optimized substrate. Maintains outstanding interface thermal elasticity under high temp, pressure, and humidity for aerospace applications.
Thermal Pad (80S = Single-Sided Adhesive)
Extreme performance thermal pad offering ultimate heat transfer rates. Specifically developed for next-gen high-performance computing and EV inverter power chips, breaking through traditional heat dissipation bottlenecks.
Embedded with fiberglass mesh to drastically enhance tear and puncture resistance, preventing high-voltage breakdown.
Thermal Pad + Fiberglass
Embedded with high-quality fiberglass reinforcement. Ensures the insulation pad is not pierced by sharp metal edges even under high shear forces from fastening screws, effectively preventing circuit shorts.
Thermal Pad + Fiberglass
Structurally enhanced thermal insulation pad balancing heat transfer with physical tensile rigidity. Center-placed fiberglass technology ensures uniform thickness and dielectric withstand voltage under high torque assembly.
Thermal Pad + Fiberglass
Industrial-grade reinforced heatsink pad with exceptional dimensional stability. Suitable for large-area heating components to prevent stretching deformation during installation. Widely used in EV battery modules.
Thermal Pad + Fiberglass
High-efficiency composite fiberglass thermal pad. The special formula allows it to provide high tear resistance rigidity while its surface maintains sufficient wetting conformability. Mature product for telecom power supplies.
Thermal Pad + Fiberglass
Heavy-duty reinforced thermal pad designed for mechanical structures enduring high compression and severe vibration. The fiberglass substrate provides robust physical puncture defense for core modules.
Thermal Pad + Fiberglass
High performance with high rigidity. Perfectly integrates a high-fill conductive core with a thin fiberglass layer. Absolutely no physical shattering or uneven thickness under high temp/pressure. Suitable for base station RF units.
Thermal Pad + Fiberglass
Top-tier structured thermal insulation pad with outstanding voltage breakdown resistance and tensile rigidity. Maintains complete physical structural integrity under extreme thermal shock and high torque assembly.
Thermal Pad + Fiberglass
Flagship composite model providing extreme thermal conductivity and the highest mechanical puncture strength. Offers absolutely safe insulation cooling for EV electric drives and inverter power semiconductors (IGBT/SiC).
Providing 1-part room temperature vulcanizing (RTV), high-thermal conductive bonding solutions.
Thermal Adhesive (White)
1-part, RTV thermal conductive adhesive. Offers good thermal conductivity and bonding strength. Cures into a tough elastomer with superior thermal cycling resistance, moisture-proofing, and insulation performance.
Thermal Adhesive (Gray)
Gray highly efficient thermal conductive adhesive utilizing an upgraded high-conductivity powder formula. Designed for bonding high-power components and heatsinks, offering excellent electrical insulation and high-temp resistance.
Ultra-high thermal conductivity interface materials widely used in high-density electronic cooling systems.
Artificial Graphite Sheet
High-conductivity artificial graphite material with extremely high horizontal thermal performance. Thin, lightweight, and bendable. Rapidly diffuses concentrated point heat evenly, with excellent shielding effectiveness for smartphones and EV chips.